Semiconductor Packaging Design Engineer

Job DescriptionA leading semiconductor company is seeking a Staff Engineer to oversee Packaging Layout Design and Simulation.Design and develop semiconductor packaging layouts in accordance with customer specifications.Review technical specifications to ensure compliance with industry guidelines.Required Skills & QualificationsThe ideal candidate will...

Advanced Semiconductor Packaging SpecialistThe role of a semiconductor packaging specialist is to design, develop and optimize advanced semiconductor packages. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies.Key Responsibilities:Design innovative semiconductor...

Location: North-east - AWS & VB provided **About the Role**: This is an exciting opportunity to work at the forefront of engineering innovation, collaborating with cross-functional teams to deliver solutions that are accurate, efficient, and production-ready. **Key Responsibilities**: - Translate customer and system requirements into robust mechanical...

Job Title: Advanced Semiconductor Packaging SpecialistLocation: Admiralty Street, SingaporeJob Description:We are seeking an experienced Advanced Semiconductor Packaging Specialist to join our team. The successful candidate will be responsible for designing and developing innovative packaging solutions for semiconductor devices.Key Responsibilities:Design...

Job DescriptionWe are seeking a talented Staff Engineer to join our team in the field of semiconductor packaging layout design and simulation. As a Staff Engineer, you will be responsible for creating innovative packaging layouts that meet customer specifications and requirements.Your primary duties will include:Designing and developing semiconductor...

Job Title: TCB Design Engineer The role of a TCB Design Engineer is to design, develop and optimize TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies. Key...

Key ResponsibilitiesWe are seeking a skilled engineer to design, develop and optimize TCB modules subsystems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.Must-have:Design & Development: Design innovative TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding. Responsible for 3D design and 2D drawings,...

Position title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...

Software Development Opportunity As a skilled Software Developer, you will design and implement software solutions for advanced packaging semiconductor equipment. This role involves developing high-performance software to enhance automation, control, and data processing for semiconductor manufacturing. Key Responsibilities: Design, develop, and...

TCB Design Engineer Job DescriptionThe TCB Design Engineer plays a crucial role in the development of advanced semiconductor packaging solutions.Job Responsibilities:Design and Development: Develop innovative thermal control systems for Chip-to-Wafer or Chip-to-Substrate bonding, creating 3D designs, 2D drawings, and managing bill of materials...