Thermal Design Expert for Semiconductor Bonding

Job Title: Thermal Bonding SpecialistA THERMAL BONDING SPECIALIST is a critical member of the team, responsible for designing and developing thermal bonding modules used in advanced semiconductor packaging.This role requires expertise in thermal control during chip-to-wafer or chip-to-substrate bonding, directly impacting process reliability, yield, and...

Job Title: Thermal Bonding Specialist "> A Thermal Bonding Specialist is responsible for designing, developing and optimizing thermal bonding modules used in advanced semiconductor packaging. This role is critical for ensuring precise, uniform and rapid thermal control during chip-to-wafer or chip-to-substrate bonding, directly impacting process...

As a leading expert in semiconductor bonding, you will play a crucial role in designing and developing cutting-edge bonding solutions for semiconductor packaging.This position requires a strong understanding of thermal and mechanical analysis to optimize heating/cooling profiles and minimize thermal gradients across the bondhead/bondstage.Key...

Advanced Bonding Solutions Engineer As an Advanced Bonding Solutions Engineer, you will play a crucial role in designing and developing cutting-edge bonding solutions for semiconductor packaging. This position requires a strong understanding of thermal and mechanical analysis to optimize heating/cooling profiles and minimize thermal gradients across the...

Job Title: Thermal Bonding Specialist">The role of a Thermal Bonding Specialist is crucial in ensuring precise, uniform and rapid thermal control during chip-to-wafer or chip-to-substrate bonding.Design & Development: Design innovative thermal bonding modules assemblies for chip-to-wafer or chip-to-substrate bonding. Key responsibilities include creating 3D...

Position title : TCB (Thermo Compression Bonding) Design Engineer / Semiconductor Packaging Design Engineer Location: Admiralty StreetWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used...

Job Title: Advanced Thermal Bonding EngineerA highly skilled and innovative engineer is required to lead the design, development, and optimization of advanced thermal bonding modules.Key Responsibilities:Design & Development:Design innovative thermal bonding assemblies for chip-to-wafer or chip-to-substrate applications.Develop 3D designs and 2D drawings,...

Job OverviewA semiconductor packaging expert is responsible for designing, developing, and optimizing modules used in thermo-compression bonding equipment.This role ensures precise thermal control during chip-to-wafer or chip-to-substrate bonding, impacting process reliability, yield, and throughput.

Advanced Semiconductor Packaging ExpertThis is a challenging role that requires designing and developing cutting-edge TCB modules for semiconductor packaging.As an expert in thermal management, you will be responsible for optimizing the performance of our TCB equipment by minimizing thermal gradients and maximizing temperature uniformity. Your work will...

Design Engineer - Advanced Semiconductor Bonding SystemsWe are seeking a highly skilled Design Engineer to join our team. As a key member of our design team, you will be responsible for designing and developing advanced semiconductor bonding systems.The ideal candidate will have a strong background in mechanical engineering and experience with CAD design...