Thermal Bonding Module Design Engineer

Job Title: Thermal Bonding Specialist "> A Thermal Bonding Specialist is responsible for designing, developing and optimizing thermal bonding modules used in advanced semiconductor packaging. This role is critical for ensuring precise, uniform and rapid thermal control during chip-to-wafer or chip-to-substrate bonding, directly impacting process...

Job TitleAchieve Excellence in Semiconductor Bonding as a Thermal Design Expert">About the Role:">This is an exciting opportunity to join our team as a Thermal Design Engineer, where you will be responsible for designing, developing, and optimizing the Thermo Compression Bonding (TCB) modules subsystem used in advanced semiconductor packaging.">Your Key...

Job Title: Advanced Thermal Bonding EngineerA highly skilled and innovative engineer is required to lead the design, development, and optimization of advanced thermal bonding modules.Key Responsibilities:Design & Development:Design innovative thermal bonding assemblies for chip-to-wafer or chip-to-substrate applications.Develop 3D designs and 2D drawings,...

Job Title: "> TCB (Thermo Compression Bonding) Engineering Specialist "> "> Job Description: "> A TCB engineering specialist designs, develops and optimizes TCB modules used in Thermo-Compression Bonding equipment for advanced semiconductor packaging. "> This role is critical to ensuring precise thermal control during Chip-to-Wafer or Chip-to-Substrate...

Position title : TCB (Thermo Compression Bonding) Design Engineer / Semiconductor Packaging Design Engineer Location: Admiralty Street Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem...

Thermo Compression Bonding (TCB) Module Design ExpertWe are seeking an experienced and skilled Thermo Compression Bonding (TCB) Module Design Expert to join our team.The successful candidate will be responsible for designing innovative TCB module assemblies for advanced semiconductor packaging, including 3D design and 2D drawings, bill of materials...

Advanced Bonding Solutions Engineer As an Advanced Bonding Solutions Engineer, you will play a crucial role in designing and developing cutting-edge bonding solutions for semiconductor packaging. This position requires a strong understanding of thermal and mechanical analysis to optimize heating/cooling profiles and minimize thermal gradients across the...

Thermal Control Engineer Job Description">The role of a Thermal Control Engineer is critical for the development and optimization of thermal control systems used in advanced semiconductor packaging equipment.">Design and Development:We are seeking an experienced Thermal Control Engineer to design and develop thermal control modules for Chip-to-Wafer or...

Job SummaryA thermal engineer plays a pivotal role in ensuring precise and uniform temperature management during semiconductor packaging processes.Key Responsibilities:Design and develop thermal management subsystems for bonding equipment used in advanced packaging applications.Collaborate with cross-functional teams to optimize module performance and...

Position title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Street Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...