TCB (Thermo Compression Bonding) Module Design Engineer
3 days ago
Job Title: ">
TCB (Thermo Compression Bonding) Engineering Specialist
"> ">Job Description:
">A TCB engineering specialist designs, develops and optimizes TCB modules used in Thermo-Compression Bonding equipment for advanced semiconductor packaging.
">This role is critical to ensuring precise thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.
"> ">Key Responsibilities:
">- ">
- Design innovative TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding. ">
- Responsible for 3D design and 2D drawings, bill of materials management, failure mode effect analysis, error budgeting, and design for manufacturability and assembly. ">
- Planning, scheduling, and costing of machine modules. ">
- Prototyping and testing. ">
- Oversee fabrication of prototype modules and their integration with TCB platforms. ">
- Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation. ">
- Collaborate with electrical, vision, and software engineers for machine integration. ">
- Collaborate with the process team to improve the bonding machine. ">
- Collaborate with manufacturing engineers to ensure design for manufacturability and safe, robust assembly of module systems. ">
- Support
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Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Street Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...
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