Advanced Packaging Design Engineer
1 week ago
Position title : TCB (Thermo Compression Bonding) Design Engineer / Advanced Packaging Design Engineer (TCB / Equipment Design)
Location: Admiralty Street
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)
Role Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.
Key Responsibilities
Must-have:
Design & Development
Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
Planning, Scheduling and Costing of Machines Modules.
Prototyping & Testing
Oversee fabrication of prototype modules and their integration with TCB platforms.
Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
Process & Manufacturing Support
Collaborate with Electrical, Vision and Software Engineers for the machine integration.
Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
Support
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