TCB Advanced Semiconductor Packaging Design Engineer
2 days ago
Position title: TCB (Thermo Compression Bonding) Design Engineer
Location: Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)
Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.
Key Responsibilities
Must-have:
Design & Development
Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
Planning, Scheduling and Costing of Machines Modules.
Prototyping & Testing
Oversee fabrication of prototype modules and their integration with TCB platforms.
Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
Process & Manufacturing Support
Collaborate with Electrical, Vision and Software Engineers for the machine integration.
Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
Support
-
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...
-
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title: TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment...
-
Singapore beBeeSemiconductor Full time $6,000 - $8,000TCB Semiconductor Packaging Design Engineer Job SummaryAs a TCB Semiconductor Packaging Design Engineer, you will play a critical role in designing and developing cutting-edge TCB modules subsystems used in advanced semiconductor packaging. This position requires expertise in thermal and mechanical analysis, as well as proficiency in 3D/2D CAD design using...
-
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for...
-
Advanced Semiconductor Packaging Specialist
4 days ago
Singapore beBeeEngineer Full timeJob Title: TCB Design Engineer The role of a TCB Design Engineer is to design, develop and optimize TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies. Key...
-
Advanced Semiconductor Packaging Specialist
1 week ago
Singapore beBeeSemiconductor Full time $90,000 - $120,000TCB Design EngineerThe role of a TCB Design Engineer involves designing, developing and optimizing TCB modules subsystems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies.Key...
-
Advanced Semiconductor Packaging Specialist
5 days ago
Singapore beBeeThermocompression Full time $80,000 - $120,000TCB Design Engineer Job SummaryThis role is responsible for designing, developing, and optimizing TCB modules subsystems used in Thermo-Compression Bonding equipment for advanced semiconductor packaging. The TCB Design Engineer will play a critical part in ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding.
-
TCB Design Engineer
2 hours ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty StreetWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...
-
Advanced Packaging Design Engineer
2 weeks ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer / Advanced Packaging Design Engineer (TCB / Equipment Design) Location: Admiralty StreetWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB...
-
TCB Design Engineer
6 days ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeOverview Position: TCB (Thermo Compression Bonding) Design Engineer. Location: Admiralty Street. Working Days: 5 Day A Week. Working hours: 9:00am - 6:00pm. Salary: $6000 - $8000 (depends experience). Interested applicants can also send your resume to WA: (Ms Lynne) and allow our Consultant to match you with our Clients. No Charges will be incurred by...
