Cutting-Edge TCB Semiconductor Packaging Design Engineer Wanted
5 days ago
As a TCB Semiconductor Packaging Design Engineer, you will play a critical role in designing and developing cutting-edge TCB modules subsystems used in advanced semiconductor packaging. This position requires expertise in thermal and mechanical analysis, as well as proficiency in 3D/2D CAD design using CREO Parametric.
Key Responsibilities:- Design and develop innovative TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
- Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, and Design for Manufacturability and Assembly (DFMA).
- Plan, schedule, and cost machines modules.
- Prototype and test TCB modules and their integration with TCB platforms.
- Collaborate with electrical, vision, and software engineers for machine integration.
- Work with process teams to improve bonding machine capabilities.
- Support the transfer of new heater designs from R&D to production.
- Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Minimum 2-5 years of experience in design and development of equipment or semiconductor packaging.
- Proficiency in 3D/2D CAD knowledge, preferably with CREO Parametric experience.
- Experience with TCB or Laser Assisted bonding technologies is highly preferred.
- Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis skills.
This role offers a challenging and rewarding opportunity to work at the forefront of advanced semiconductor packaging technology. As a TCB Semiconductor Packaging Design Engineer, you will have the opportunity to collaborate with a talented team of engineers and researchers, and contribute to the development of innovative solutions that drive industry progress.
The ideal candidate will possess strong technical skills, excellent communication and collaboration skills, and a passion for advancing the field of semiconductor packaging.
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