Semiconductor Packaging Engineer

4 days ago

Singapore beBeePackaging Full time $80,000 - $120,000

Job Title: Senior Semiconductor Packaging Specialist

This role is a pivotal part of our team, responsible for the development of cutting-edge semiconductor packaging solutions.

Key Responsibilities:

  • Design and develop innovative TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
  • Manage 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
  • Plan, schedule, and cost machines modules.
  • Oversee fabrication of prototype modules and their integration with TCB platforms.
  • Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
  • Collaborate with Electrical, Vision, and Software Engineers for machine integration.
  • Collaborate with process teams to improve the bonding machine.
  • Support safe assembly of module systems.

Required Skills and Qualifications:

  • Proficient in design software and tools.
  • Excellent problem-solving and analytical skills.
  • Strong communication and collaboration skills.
  • Ability to work in a fast-paced environment.

Join us in shaping the future of semiconductor packaging

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