Senior Semiconductor Packaging Engineer

2 days ago

Singapore beBeeThermocompression Full time $150,000 - $180,000

TCB Engineer Position Overview

A TCB engineer is responsible for designing and developing subsystems used in thermo-compression bonding equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during chip-to-wafer or chip-to-substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

  • Design & Development
    • Design innovative modules assemblies for chip-to-wafer or chip-to-substrate bonding.
    • Responsible for 3D design and 2D drawings, bill of materials management, failure mode effects analysis, error budgeting, design for manufacturability, and assembly planning.
    • Planning, scheduling, and costing of machine modules.
  • Prototyping & Testing
    • Oversee fabrication of prototype modules and their integration with TCB platforms.
    • Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
  • Process & Manufacturing Support
    • Collaborate with electrical, vision, and software engineers for machine integration.
    • Collaborate with process teams to improve bonding machines, including bonder heads, stages, temperature/power controls.
    • Collaborate with manufacturing engineers to ensure design for manufacturability and safe, robust assembly of module systems.
    • Support transfer of new heater designs from R&D to production, including documentation, bill of materials, and assembly guides.
  • Compliance & Documentation
    • Document all designs, simulations, and test results according to quality management and IP standards.
    • Remain updated on relevant industry standards for environment, health, and safety, contamination control, and semiconductor packaging equipment.

Requirements

  • Bachelor's or master's degree in materials science, mechanical engineering, electrical engineering, or a related field.
  • Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
  • Proficiency in 3D/2D CAD knowledge, with experience in Creo Parametric preferred. Exposure to Creo Windchill PLM system is a plus.
  • Experience with TCB or laser-assisted bonding technologies is highly preferred.
  • Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.).

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