Senior Semiconductor Packaging Engineer

18 hours ago

Singapore beBeePackaging Full time $6,000 - $8,000
Job Title

TCB Design Engineer (Semiconductor Packaging)

About the Role

This position involves designing and developing TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding. The ideal candidate will have expertise in 3D design, BOM management, FMEA, error budgeting, and Design for Manufacturability and Assembly (DFMA).

The role requires collaboration with Electrical, Vision, and Software Engineers for machine integration, as well as process team to improve the bonding machine. Additionally, the successful candidate will ensure DFMA and safe, robust assembly of module systems.

Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field is required. Minimum 2–5 years of hands-on experience in design and development of equipment or semiconductor packaging or advanced interconnect processes is also necessary.

Responsibilities
  • Design & Development:
    • Design innovative TCB modules assemblies;
    • Responsible for 3D design, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA);
  • Prototyping & Testing:
    • Oversee fabrication of prototype modules and their integration with TCB platforms;
    • Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation;
  • Process & Manufacturing Support:
    • Collaborate with Electrical, Vision, and Software Engineers for machine integration;
    • Collaborate with process team to improve the bonding machine;
    • Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems;
  • Compliance & Documentation:
    • Document all designs, simulations, and test results according to quality management and IP standards;

Requirements: Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field. Minimum 2–5 years of hands-on experience in design and development of equipment or semiconductor packaging or advanced interconnect processes.

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