Semiconductor Packaging Innovation Engineer
4 days ago
Job Description:
This position is a key member of our engineering team responsible for designing innovative semiconductor packaging solutions. The role involves the development and optimization of thermal compression bonding (TCB) modules subsystems used in advanced semiconductor packaging.
Responsibilities:
- Design novel TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
- Create 3D designs and 2D drawings, manage BOMs, perform FMEA, error budgeting, and Design for Manufacturability and Assembly (DFMA).
- Oversee the fabrication of prototype modules and their integration with TCB platforms, analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
- Collaborate with Electrical, Vision, and Software Engineers for machine integration, work with the process team to improve the bonding machine, and collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
- Document all designs, simulations, and test results according to quality management and IP standards.
Requirements:
- Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Minimum 2-5 years of experience in design and development of equipment or semiconductor packaging or advanced interconnect processes.
- Knowledge of 3D/2D CAD, preferably CREO Parametric, and exposure to CREO Windchill PLM system.
- Experience with TCB technologies and familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.).
- Excellent trouble-shooting skills, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
- Knowledge of bonding process and materials behavior under thermal/mechanical stress.
- Experience with thermal system/component design, heaters, sensors, thermal interfaces, including hands-on and simulation skills.
About Us:
We are a leading global semiconductor company seeking highly skilled professionals to join our team.
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