Innovative Semiconductor Packaging Specialist

Job OverviewOur company is seeking a Senior Semiconductor Packaging Specialist to join our team. The successful candidate will be responsible for designing and developing semiconductor packaging layouts in accordance with customer specifications and requirements.Key Responsibilities:• Design and develop semiconductor packaging layouts, ensuring compliance...

Job Description: As a TCB Design Engineer, you will be responsible for designing and developing innovative solutions for Thermo-Compression Bonding (TCB) equipment used in advanced semiconductor packaging. In this critical role, you will play a key part in ensuring precise thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, impacting process...

Job Description:This position is a key member of our engineering team responsible for designing innovative semiconductor packaging solutions. The role involves the development and optimization of thermal compression bonding (TCB) modules subsystems used in advanced semiconductor packaging.Responsibilities:Design novel TCB module assemblies for Chip-to-Wafer...

Job Role: Semiconductor Innovation SpecialistWe are seeking a skilled professional to join our team as a Semiconductor Innovation Specialist. This role involves working closely with cross-functional teams to design, test, and deploy cutting-edge semiconductor products.Develop and review feature requirements, design test plans, collect data, perform analysis,...

Job Title: Senior Semiconductor Packaging SpecialistThis role is a pivotal part of our team, responsible for the development of cutting-edge semiconductor packaging solutions.Key Responsibilities:Design and develop innovative TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.Manage 3D design and 2D drawings, BOM management, FMEA, error...

Job Title: Semiconductor Packaging ExpertThis role is focused on designing, developing and optimizing TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. The ideal candidate will possess strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding...

Job Title: Advanced Semiconductor Assembly SpecialistJob Summary:This is a challenging role for an experienced Packaging Engineer to take on, contributing to the success of our organization.We are seeking a highly skilled and experienced Senior Packaging Engineer to join us. The successful candidate will be responsible for developing advanced packaging...

Job Title: TCB Design Engineer The role of a TCB Design Engineer is to design, develop and optimize TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies. Key...

TCB Design EngineerThe role of a TCB Design Engineer involves designing, developing and optimizing TCB modules subsystems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies.Key...

Job Title: High-Temperature Bonding SpecialistRole Summary:We are seeking a skilled professional to design and develop Thermo-Compression Bonding modules for advanced semiconductor packaging. The ideal candidate will be responsible for creating innovative designs that ensure precise, uniform, and rapid thermal control during Chip-to-Wafer or...