Innovative Semiconductor Packaging Solutions Specialist

Job Title: Semiconductor Packaging Design Engineer (Thermal-Compression Bonding / TCB)Position Overview:A Thermal-Compression Bonding (TCB) Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in advanced semiconductor packaging.This role is critical for ensuring precise, uniform, and rapid thermal control...

Job Description:This position is a key member of our engineering team responsible for designing innovative semiconductor packaging solutions. The role involves the development and optimization of thermal compression bonding (TCB) modules subsystems used in advanced semiconductor packaging.Responsibilities:Design novel TCB module assemblies for Chip-to-Wafer...

Job Role: Semiconductor Innovation SpecialistWe are seeking a skilled professional to join our team as a Semiconductor Innovation Specialist. This role involves working closely with cross-functional teams to design, test, and deploy cutting-edge semiconductor products.Develop and review feature requirements, design test plans, collect data, perform analysis,...

Advanced Semiconductor Packaging SpecialistThe role of a semiconductor packaging specialist is to design, develop and optimize advanced semiconductor packages. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies.Key Responsibilities:Design innovative semiconductor...

Job Title: Packaging EngineerPackaging Engineer - Lead the Way in Semiconductor Manufacturing The semiconductor industry is undergoing a rapid transformation, and we are proud to be playing a major role in the development of the semiconductor ecosystem in India.This is an excellent opportunity for a Packaging Engineer to join our team and contribute to the...

TCB Design EngineerAs a seasoned TCB Design Engineer, you will be responsible for developing and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.Key Responsibilities:

Job Title: Senior Semiconductor Packaging SpecialistThis role is a pivotal part of our team, responsible for the development of cutting-edge semiconductor packaging solutions.Key Responsibilities:Design and develop innovative TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.Manage 3D design and 2D drawings, BOM management, FMEA, error...

**Job Title:** Advanced Packaging Design Engineer – Thermo-Compression Bonding SystemsThis is a challenging role that requires expertise in designing, developing, and optimizing TCB modules subsystems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.The successful candidate will be responsible for creating innovative...

Process Innovation SpecialistThis is a unique opportunity to leverage your expertise in precision engineering and automation solutions to drive high-performance outcomes in semiconductor manufacturing. Our organization partners with a global leader in the industry, focusing on continuous process innovation and advancement.

Job Title: Advanced Packaging Solutions SpecialistJob Summary:We are seeking an experienced Advanced Packaging Solutions Specialist to drive thermal solutions for next-generation hybrid bonding development.Key Responsibilities:Lead process development efforts for establishing thermal solutions required for advanced packaging solutions needed in product lines...