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Engineer, Advanced Packaging Integration Engineering
2 weeks ago
We are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron's Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.
We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team
Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.
Key responsibilities and duties include:
Technology Development:
- Develop and enable advanced package technology for various post-fab wafer finish and assembly processes
- Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
- Integrate semiconductors while partnering with process and product engineering teams
- Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements
- Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes
- Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements
- Ensure defense coverage through process, measurement, inspection, and testing
- Establish correlations between defense mechanisms to identify improvement opportunities
- Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
- Work closely with internal and external partners to build and implement technology development strategies aligned with organizational and business objectives
- Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
- Ensure smooth transition from new product development, qualification, small volume production to high volume production
- Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities
- B.S/M.S./Ph.D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or other related technical fields
- Experiences in semiconductor process integration will be advantageous
- Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering team
- Ability to resolve complex issues through root-cause or model-based problem solving
- Tenacity to work effectively under timelines and limited resources
- Consistent track record to solve problems and address root causes
- Good communication skills
- Keen in the semiconductor industry
- Showcase leadership potential
