Senior Semiconductor Packaging Design Expert

2 weeks ago

Singapore beBeeSemiconductor Full time $6,000 - $8,000

Job Summary:

We are seeking a skilled Senior Semiconductor Packaging Design Expert to join our team. The ideal candidate will have extensive experience in designing and developing advanced semiconductor packaging solutions.

About the Role:

The Senior Semiconductor Packaging Design Expert will be responsible for leading the design and development of TCB modules subsystems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.

Main Responsibilities:

  • Design & Development:
    • Lead innovative TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
    • Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
    • Planning, Scheduling and Costing of Machines Modules.
  • Prototyping & Testing:
    • Oversee fabrication of prototype modules and their integration with TCB platforms.
    • Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
  • Process & Manufacturing Support:
    • Collaborate with Electrical, Vision and Software Engineers for the machine integration.
    • Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
    • Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
    • Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
  • Compliance & Documentation:
    • Document all designs, simulations, and test results according to quality management and IP standards.
    • Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Requirements:

  • Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Minimum 2-5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
  • 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
  • Experience with TCB or Laser Assisted bonding technologies is highly preferred.
  • Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)

Benefits:

This is an exciting opportunity for a talented professional to join our team as a Senior Semiconductor Packaging Design Expert.

What We Offer:

We offer a competitive salary, excellent benefits, and opportunities for career growth and professional development.

  • Senior Semiconductor Packaging Design Expert

    6 days ago

    Singapore beBeeSemiconductor Full time

    Job Summary: We are seeking a skilled Senior Semiconductor Packaging Design Expert to join our team. The ideal candidate will have extensive experience in designing and developing advanced semiconductor packaging solutions. About the Role: The Senior Semiconductor Packaging Design Expert will be responsible for leading the design and development of TCB...

  • Semiconductor Packaging Expert

    7 days ago

    Singapore beBeePackaging Full time $80,000 - $120,000

    Job Title: Semiconductor Packaging ExpertThis role is focused on designing, developing and optimizing TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. The ideal candidate will possess strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding...

  • Semiconductor Packaging Expert

    1 week ago

    Singapore beBeePackaging Full time $80,000 - $120,000

    Job Title: Advanced Semiconductor Assembly SpecialistJob Summary:This is a challenging role for an experienced Packaging Engineer to take on, contributing to the success of our organization.We are seeking a highly skilled and experienced Senior Packaging Engineer to join us. The successful candidate will be responsible for developing advanced packaging...

  • Semiconductor Assembly Packaging Expert

    1 week ago

    Singapore beBeePackaging Full time $80,000 - $150,000

    We are seeking an expert in semiconductor assembly to lead the development of advanced packaging technologies and processes.Key ResponsibilitiesDesign innovative packaging solutions that enhance device performance and yield.Provide technical support and collaborate with external customers and partners for joint development.Work closely with internal R&D and...

  • Senior Semiconductor Packaging Specialist

    7 days ago

    Singapore beBeeSemiconductor Full time $90,000 - $120,000

    Job OverviewOur company is seeking a Senior Semiconductor Packaging Specialist to join our team. The successful candidate will be responsible for designing and developing semiconductor packaging layouts in accordance with customer specifications and requirements.Key Responsibilities:• Design and develop semiconductor packaging layouts, ensuring compliance...

  • Semiconductor Packaging Expert

    1 week ago

    Singapore beBeeEngineering Full time $90,000 - $120,000

    About the RoleOur company is seeking a skilled Application/Process Engineer to support the development, optimization, and deployment of advanced die bonding applications for next-generation semiconductor packaging.

  • Advanced Packaging Expert

    2 weeks ago

    Singapore beBeePackaging Full time $150,000 - $200,000

    Job TitleA seasoned semiconductor expert is sought to join our Advanced Packaging team in Singapore. The ideal candidate will have extensive experience in designing and optimizing advanced packaging processes.

  • Semiconductor Packaging Engineer

    1 week ago

    Singapore beBeePackaging Full time $80,000 - $120,000

    Job Title: Senior Semiconductor Packaging SpecialistThis role is a pivotal part of our team, responsible for the development of cutting-edge semiconductor packaging solutions.Key Responsibilities:Design and develop innovative TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.Manage 3D design and 2D drawings, BOM management, FMEA, error...

  • Senior Semiconductor Packaging Engineer

    7 days ago

    Singapore beBeePackaging Full time $6,000 - $8,000

    Job TitleTCB Design Engineer (Semiconductor Packaging)About the RoleThis position involves designing and developing TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding. The ideal candidate will have expertise in 3D design, BOM management, FMEA, error budgeting, and Design for Manufacturability and Assembly (DFMA).The role requires...

  • Senior Semiconductor Packaging Engineer

    7 days ago

    Singapore beBeeThermocompression Full time $150,000 - $180,000

    TCB Engineer Position OverviewA TCB engineer is responsible for designing and developing subsystems used in thermo-compression bonding equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during chip-to-wafer or chip-to-substrate bonding, directly impacting process reliability, yield,...