Senior Semiconductor Packaging Design Expert
17 hours ago
Job Summary:
We are seeking a skilled Senior Semiconductor Packaging Design Expert to join our team. The ideal candidate will have extensive experience in designing and developing advanced semiconductor packaging solutions.
About the Role:
The Senior Semiconductor Packaging Design Expert will be responsible for leading the design and development of TCB modules subsystems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.
Main Responsibilities:
- Design & Development:
- Lead innovative TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
- Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
- Planning, Scheduling and Costing of Machines Modules.
- Prototyping & Testing:
- Oversee fabrication of prototype modules and their integration with TCB platforms.
- Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
- Process & Manufacturing Support:
- Collaborate with Electrical, Vision and Software Engineers for the machine integration.
- Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
- Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
- Support
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