Advanced Semiconductor Packaging Expert

2 weeks ago

Singapore beBeeThermocompression Full time $6,000 - $8,000

TCB Design Engineer Job Description

The primary role of this TCB Design Engineer position is to design, develop and optimize TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.

This critical role ensures precise, uniform and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield and throughput.

Key Responsibilities:
  • Design and Development:
    • Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
    • Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
    • Planning, Scheduling and Costing of Machines Modules.
  • Prototyping and Testing:
    • Oversee fabrication of prototype modules and their integration with TCB platforms.
    • Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency or material degradation.
  • Process and Manufacturing Support:
    • Collaborate with Electrical, Vision and Software Engineers for the machine integration.
    • Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls).
    • Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
    • Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
  • Compliance and Documentation:
    • Document all designs, simulations, and test results according to quality management and IP standards.
    • Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.
Requirements:
  • Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering or a related field.
  • Minimum 2–5 years of hands-on experience in design and development of equipment or semiconductor packaging or advanced interconnect processes.
  • 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
  • Experience with TCB or Laser Assisted bonding technologies is highly preferred.
  • Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM etc.).
  • Excellent knowledge of trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
  • Knowledge of bonding process and materials behavior under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
  • Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
  • Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus.

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