TCB Design Engineer
5 days ago
Position: TCB (Thermo Compression Bonding) Design Engineer. Location: Admiralty Street. Working Days: 5 Day A Week. Working hours: 9:00am - 6:00pm. Salary: $6000 - $8000 (depends experience).
Interested applicants can also send your resume to WA: (Ms Lynne) and allow our Consultant to match you with our Clients. No Charges will be incurred by Candidates for any service rendered.
TAN LEE XIAN Reg No: R
The Supreme HR Advisory Pte Ltd EA No: 14C7279
Role OverviewA TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.
ResponsibilitiesMust-have:
- Design & Development — Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding; responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA); planning, scheduling and costing of machine modules.
- Prototyping & Testing — Oversee fabrication of prototype modules and their integration with TCB platforms; analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
- Process & Manufacturing Support — Collaborate with Electrical, Vision and Software Engineers for machine integration; collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls); collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems; support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
- Compliance & Documentation — Document all designs, simulations, and test results according to quality management and IP standards; remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.
Good-to-have:
- Thermal & Mechanical Analysis — Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/bondstage; design and validate cooling channels inside the bondhead/bondstage to achieve rapid cooling and enhance temperature uniformity; mounting of the heater assembly for micron-level Z positioning and planarity during operation.
Requirements
- Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Minimum 2–5 years of hands-on experience in design and development of equipment or semiconductor packaging or advanced interconnect processes.
- 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
- Experience with TCB or Laser Assisted bonding technologies is highly preferred.
- Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
TAN LEE XIAN Reg No: R
The Supreme HR Advisory Pte Ltd EA No: 14C7279
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