Back-end Packaging Design Engineer

2 weeks ago


Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time

Position title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty StreetWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.Key Responsibilities Must-have:• \tDesign & Development• \tDesign innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.• \tResponsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).• \tPlanning, Scheduling and Costing of Machines Modules.• \tPrototyping & Testing• \tOversee fabrication of prototype modules and their integration with TCB platforms.• \tAnalyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.• \tProcess & Manufacturing Support• \tCollaborate with Electrical, Vision and Software Engineers for the machine integration.• \tCollaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)• \tCollaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.• \tSupport


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