TCB Design Engineer

7 days ago

Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time
Position title : TCB (Thermo Compression Bonding) Design Engineer
Location: Admiralty Street
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)
Role Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.
Key Responsibilities
Must-have:

• \tDesign & Development

• \tDesign innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.

• \tResponsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).

• \tPlanning, Scheduling and Costing of Machines Modules.

• \tPrototyping & Testing

• \tOversee fabrication of prototype modules and their integration with TCB platforms.

• \tAnalyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.

• \tProcess & Manufacturing Support

• \tCollaborate with Electrical, Vision and Software Engineers for the machine integration.

• \tCollaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)

• \tCollaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.

• \tSupport

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