Thermo Compression Bonding Module Specialist
4 days ago
Thermo Compression Bonding (TCB) Module Design Expert
We are seeking an experienced and skilled Thermo Compression Bonding (TCB) Module Design Expert to join our team.
The successful candidate will be responsible for designing innovative TCB module assemblies for advanced semiconductor packaging, including 3D design and 2D drawings, bill of materials management, failure mode and effects analysis, error budgeting, and design for manufacturability and assembly.
The ideal candidate will have a deep understanding of thermal control during Chip-to-Wafer or Chip-to-Substrate bonding and be able to collaborate with electrical, vision, and software engineers for machine integration. Additionally, the candidate will work closely with the process team to improve the bonding machine and ensure design for manufacturability and safe, robust assembly of module systems.
The successful candidate will also be responsible for documenting all designs, simulations, and test results according to quality management and intellectual property standards, as well as remaining updated on relevant industry standards for environment, health, and safety, contamination control, and semiconductor packaging equipment.
- Design & Development:
- Plan, schedule, and cost machines and modules.
- Prototyping & Testing:
- Oversee fabrication of prototype modules and their integration with TCB platforms.
- Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
- Process & Manufacturing Support:
- Collaborate with Electrical, Vision, and Software Engineers for machine integration.
- Collaborate with process team to improve the bonding machine.
- Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
- Compliance & Documentation:
- Document all designs, simulations, and test results according to quality management and IP standards.
- Remain updated on relevant industry standards for environment, health, and safety, contamination control, and semiconductor packaging equipment.
Key Responsibilities:
• Plan, schedule, and cost machines and modules.
• Oversee fabrication of prototype modules and their integration with TCB platforms.
• Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
• Collaborate with Electrical, Vision, and Software Engineers for machine integration.
• Collaborate with process team to improve the bonding machine.
• Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
• Document all designs, simulations, and test results according to quality management and IP standards.
• Remain updated on relevant industry standards for environment, health, and safety, contamination control, and semiconductor packaging equipment.
Benefits:
• Competitive salary and benefits package.
• Opportunities for professional growth and development.
• Collaborative and dynamic work environment.
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Singapore beBeeEngineering Full timeJob Title: "> TCB (Thermo Compression Bonding) Engineering Specialist "> "> Job Description: "> A TCB engineering specialist designs, develops and optimizes TCB modules used in Thermo-Compression Bonding equipment for advanced semiconductor packaging. "> This role is critical to ensuring precise thermal control during Chip-to-Wafer or Chip-to-Substrate...
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