Semiconductor Packaging Thermo-Compression Bonding Specialist
1 week ago
Thermo-Compression Bonding Engineer
">About the Role">- This role involves designing and developing innovative thermo-compression bonding modules for advanced semiconductor packaging.
- The ideal candidate will have a strong understanding of thermodynamics, materials science, and mechanical engineering principles.
- You will work closely with cross-functional teams to integrate your designs into our manufacturing processes.
- Design and Development: Design, develop, and optimize TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
- Prototyping and Testing: Oversee fabrication of prototype modules and their integration with TCB platforms. Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
- Process and Manufacturing Support: Collaborate with Electrical, Vision, and Software Engineers for machine integration. Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls).
- Compliance and Documentation: Document all designs, simulations, and test results according to quality management and IP standards.
- Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
- 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
- Experience with TCB or Laser Assisted bonding technologies is highly preferred.
- Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.).
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Singapore beBeeBonding Full timeThermo-Compression Bonding Engineer "> About the Role "> This role involves designing and developing innovative thermo-compression bonding modules for advanced semiconductor packaging. The ideal candidate will have a strong understanding of thermodynamics, materials science, and mechanical engineering principles. You will work closely with...
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Advanced Semiconductor Packaging Expert
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Singapore beBeeEngineering Full timeJob Title: "> TCB (Thermo Compression Bonding) Engineering Specialist "> "> Job Description: "> A TCB engineering specialist designs, develops and optimizes TCB modules used in Thermo-Compression Bonding equipment for advanced semiconductor packaging. "> This role is critical to ensuring precise thermal control during Chip-to-Wafer or Chip-to-Substrate...
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Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Street Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...
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Singapore beBeePackaging Full time $6,000 - $8,000TCB Design EngineerAs a seasoned TCB Design Engineer, you will be responsible for developing and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.Key Responsibilities:
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Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Street Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...
