Thermal Bonding Engineer

Job Title: Advanced Thermal Bonding EngineerA highly skilled and innovative engineer is required to lead the design, development, and optimization of advanced thermal bonding modules.Key Responsibilities:Design & Development:Design innovative thermal bonding assemblies for chip-to-wafer or chip-to-substrate applications.Develop 3D designs and 2D drawings,...

Job Title: Thermal Bonding SpecialistA THERMAL BONDING SPECIALIST is a critical member of the team, responsible for designing and developing thermal bonding modules used in advanced semiconductor packaging.This role requires expertise in thermal control during chip-to-wafer or chip-to-substrate bonding, directly impacting process reliability, yield, and...

Job TitleAchieve Excellence in Semiconductor Bonding as a Thermal Design Expert">About the Role:">This is an exciting opportunity to join our team as a Thermal Design Engineer, where you will be responsible for designing, developing, and optimizing the Thermo Compression Bonding (TCB) modules subsystem used in advanced semiconductor packaging.">Your Key...

Advanced Bonding Solutions Engineer As an Advanced Bonding Solutions Engineer, you will play a crucial role in designing and developing cutting-edge bonding solutions for semiconductor packaging. This position requires a strong understanding of thermal and mechanical analysis to optimize heating/cooling profiles and minimize thermal gradients across the...

Position title : TCB (Thermo Compression Bonding) Design Engineer / Semiconductor Packaging Design Engineer Location: Admiralty Street Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem...

Roles & ResponsibilitiesWe are seeking a talented and motivated Thermal Engineer to support the design and development of thermal systems that enhance the performance and reliability of advanced electronic and mechanical components. The ideal candidate will have experience in thermal analysis, computational modeling, and experimental validation, and will...

As a Chip-to-Wafer/Chip-to-Substrate Bonding Specialist, you will play a pivotal role in designing and developing TCB modules for thermal performance optimization. Your key responsibilities will include creating 3D models, 2D drawings, BOMs, FMEA, DFMA, managing prototyping, testing, and troubleshooting to ensure reliable bonding results.Key...

We are seeking a talented and motivated Thermal Engineer to support the design and development of thermal systems that enhance the performance and reliability of advanced electronic and mechanical components. The ideal candidate will have experience in thermal analysis, computational modeling, and experimental validation, and will play a key role in driving...

Job Description: We are seeking an experienced R&D Engineer to drive the development of advanced thermal solutions for next-generation hybrid bonding. The successful candidate will lead process development efforts and collaborate with cross-functional teams to establish thermal solutions required for advanced packaging. Key Responsibilities: Lead 3DHI...

**Key Responsibilities**: - Design cooling and heating systems and follow through the deployment - Drive thermal designs with numerical approaches, model-based analysis - Conduct experiments to validate designs - Develop and optimize automation scripts for numerical analysis tools - Support thermal management for electronics - Involve in precision and...