Advanced Thermal Solutions Engineer

5 days ago

Singapore beBeeIntegration Full time

Job Description:

We are seeking an experienced R&D Engineer to drive the development of advanced thermal solutions for next-generation hybrid bonding. The successful candidate will lead process development efforts and collaborate with cross-functional teams to establish thermal solutions required for advanced packaging.

Key Responsibilities:

  • Lead 3DHI process development efforts for establishing thermal solutions required for advanced packaging solutions.
  • Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.
  • Develop expertise in processes, materials, and tooling leveraging available characterization resources.
  • Collaborate with vendors and OSATs to develop new wafer level and die level 2.5D and 3DHI processes.

Required Skills and Qualifications:

  • Masters degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field.
  • At least 10 years of prior related work experience.
  • Language Fluency - English (Written & Verbal).
  • Travel - Up to 20%.

Benefits:

This is an exciting opportunity to join a dynamic team and contribute to the development of cutting-edge technologies. The ideal candidate will have strong leadership skills, excellent communication skills, and the ability to innovate and execute on solutions that matter.

Other Responsibilities:

  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
  • Take part in hiring of other Advanced Packaging team members.
  • Mentor and guide new hires to assume their roles and responsibilities.

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