Advanced Thermal Solutions Specialist

1 day ago

Singapore beBeeThermalEngineering Full time $90,000 - $120,000

We are seeking an experienced thermal engineering professional to drive the development of advanced packaging solutions for next-generation hybrid bonding.
The ideal candidate will have a strong background in thermal engineering and materials science, with experience in process integration and planning. They will be responsible for leading 3D Heterogeneous Integration (3DHI) process development efforts, working closely with unit process engineers, manufacturing engineers, and tools & materials teams.

The key responsibilities include:

  • Developing thermal solutions for advanced packaging applications
  • Leading 3DHI process development efforts
  • Working with cross-functional teams to integrate new processes and technologies
  • Collaborating with vendors and OSATs to develop new wafer level and die level 2.5D and 3DHI processes
  • Facilitating interactions between fab teams and customers

The requirements for this position are:

  • Bachelor's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field
  • MS degree with at least 10 years of prior related work experience
  • Language Fluency - English (Written & Verbal)

Preferred qualifications include:

  • PhD education level preferred with at least 8 years of prior related work experience
  • Demonstrated prior leadership experience
  • Project management skills

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