
Advanced Thermal Control Specialist
3 days ago
TCB Design Engineer Job Summary
This role is pivotal in ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding.
About the Role
- Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
- Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
- Planning, Scheduling and Costing of Machines Modules.
Responsibilities
- Design & Development
- Prototyping & Testing
- Process & Manufacturing Support
- Compliance & Documentation
Requirements
- Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Minimum 2-5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
- 3D/2D CAD knowledge, with experience in CREO Parametric preferred.
As a TCB Design Engineer, you will be working on designing and developing cutting-edge solutions for Chip-to-Wafer or Chip-to-Substrate bonding. This role requires strong skills in thermal control, mechanical engineering, and materials science.
The ideal candidate will have a strong educational background in a relevant field and significant hands-on experience in design and development.
This is an exciting opportunity to apply your skills and experience in the field of TCB Design Engineer and contribute to the development of innovative technologies.
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