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Thermal Control Engineer

3 weeks ago

Singapore beBeeEngineering Full time $90,000 - $120,000

Are you a skilled engineer looking to drive innovation in thermal control technology?

This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding. A successful candidate will be responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.

Key Responsibilities:
  • Design & Development: Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding, including 3D design and 2D drawings, BOM management, FMEA, error budgeting, and Design for Manufacturability and Assembly (DFMA).
  • Prototyping & Testing: Oversee fabrication of prototype modules and their integration with TCB platforms, analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
  • Process & Manufacturing Support: Collaborate with Electrical, Vision, and Software Engineers for machine integration, collaborate with process team to improve the bonding machine, and collaborate with manufacturing engineers to ensure safe and robust assembly of module systems.
  • Compliance & Documentation: Document all designs, simulations, and test results according to quality management and IP standards, remain updated on relevant industry standards for environment, health, and safety, contamination control, and semiconductor packaging equipment.
Requirements:
  • Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Minimum 2-5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
  • 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
  • Experience with TCB or Laser Assisted bonding technologies is highly preferred.
  • Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.).