Advanced Thermal Management Engineer for Semiconductor Packaging
4 days ago
The role of an Advanced Thermal Management Engineer is pivotal in designing, developing, and optimizing the thermal control systems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.
Responsibilities:
- Design and development of innovative thermal management solutions for Chip-to-Wafer or Chip-to-Substrate bonding.
- Creation of 3D designs, 2D drawings, Bill of Materials (BOM), Failure Mode Effects Analysis (FMEA), error budgeting, and Design for Manufacturability and Assembly (DFMA).
- Planning, scheduling, and costing of machine modules.
- Prototyping and testing of thermal management solutions, including analysis of test results, identification of design improvements, and troubleshooting of failures related to temperature non-uniformity, inefficiency, or material degradation.
- Collaboration with electrical, vision, and software engineers for machine integration.
- Collaboration with process teams to improve the bonding machine, including bonder heads, stages, temperature/power controls, and other relevant components.
- Collaboration with manufacturing engineers to ensure Design for Manufacturability and safe, robust assembly of module systems.
Key Skills:
- Thermal management engineering
- Design and development of thermal control systems
- Failure mode effects analysis
- Error budgeting
- Design for manufacturability
- Multidisciplinary collaboration
Benefits:
This role offers a unique opportunity to contribute to the advancement of semiconductor packaging technology and work in a dynamic team environment. The successful candidate will have the chance to develop their skills and expertise in thermal management engineering and contribute to the design and development of cutting-edge thermal control systems.
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