Semiconductor Packaging Thermal Management Specialist
2 days ago
This is a challenging role that requires designing and developing cutting-edge TCB modules for semiconductor packaging.
As an expert in thermal management, you will be responsible for optimizing the performance of our TCB equipment by minimizing thermal gradients and maximizing temperature uniformity. Your work will directly impact process reliability, yield, and throughput.
- Main Responsibilities:
- Design & Development: Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding, taking into account 3D design, 2D drawings, BOM management, FMEA, error budgeting, and Design for Manufacturability and Assembly (DFMA).
- Prototyping & Testing: Oversee the fabrication of prototype modules and their integration with TCB platforms, analyzing test results to identify design improvements and troubleshoot failures.
- Process & Manufacturing Support: Collaborate with Electrical, Vision, and Software Engineers on machine integration, as well as with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
- Compliance & Documentation: Document all designs, simulations, and test results according to quality management and IP standards.
- Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
- 3D/2D CAD knowledge, preferably in CREO Parametric, with experience in CREO Windchill PLM system.
- Experience with TCB or Laser Assisted bonding technologies highly preferred.
- Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
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