Advanced Thermal Packaging Systems Specialist

Job OpportunityWe are seeking a Thermal Systems Specialist to design and develop thermal systems that enhance the performance and reliability of advanced electronic and mechanical components.

Job Title: Advanced Thermal Bonding EngineerA highly skilled and innovative engineer is required to lead the design, development, and optimization of advanced thermal bonding modules.Key Responsibilities:Design & Development:Design innovative thermal bonding assemblies for chip-to-wafer or chip-to-substrate applications.Develop 3D designs and 2D drawings,...

Thermal Engineer PositionWe are seeking a skilled Thermal Systems Developer to support the design and development of thermal systems that enhance the performance and reliability of advanced electronic and mechanical components.The ideal candidate will have experience in thermal analysis, computational modeling, and experimental validation, and will play a...

Advanced Packaging Process SpecialistWe are seeking a skilled professional to develop and optimize laser bonding processes for high-precision applications.About the Role:Create, implement, and refine laser-assisted bonding processes for product packaging and advanced interconnects.Qualify new laser bonding processes from R&D to high-volume production,...

Advanced Semiconductor Packaging ExpertThis is a challenging role that requires designing and developing cutting-edge TCB modules for semiconductor packaging.As an expert in thermal management, you will be responsible for optimizing the performance of our TCB equipment by minimizing thermal gradients and maximizing temperature uniformity. Your work will...

Job Title: Thermal Bonding Specialist "> A Thermal Bonding Specialist is responsible for designing, developing and optimizing thermal bonding modules used in advanced semiconductor packaging. This role is critical for ensuring precise, uniform and rapid thermal control during chip-to-wafer or chip-to-substrate bonding, directly impacting process...

Thermal Engineer Job DescriptionOur organization is seeking a skilled Thermal Engineer to collaborate on the design and development of advanced thermal systems. The ideal candidate will possess experience in thermal analysis, computational modeling, and experimental validation.The selected individual will play a key role in driving innovation and ensuring...

Job Description: We are seeking an experienced R&D Engineer to drive the development of advanced thermal solutions for next-generation hybrid bonding. The successful candidate will lead process development efforts and collaborate with cross-functional teams to establish thermal solutions required for advanced packaging. Key Responsibilities: Lead 3DHI...

TCB Module DesignerThe successful candidate will be responsible for designing TCB modules for Chip-to-Wafer/Chip-to-Substrate bonding. This includes creating 3D models, 2D drawings, Bill of Materials (BOMs), Failure Mode and Effects Analysis (FMEA), and Design for Manufacturability (DFMA). Key aspects of the role include optimizing heating/cooling systems...

Job Title: Thermal Bonding SpecialistA THERMAL BONDING SPECIALIST is a critical member of the team, responsible for designing and developing thermal bonding modules used in advanced semiconductor packaging.This role requires expertise in thermal control during chip-to-wafer or chip-to-substrate bonding, directly impacting process reliability, yield, and...