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4 days ago
The successful candidate will be responsible for designing TCB modules for Chip-to-Wafer/Chip-to-Substrate bonding. This includes creating 3D models, 2D drawings, Bill of Materials (BOMs), Failure Mode and Effects Analysis (FMEA), and Design for Manufacturability (DFMA). Key aspects of the role include optimizing heating/cooling systems using computational fluid dynamics (CFD)/finite element analysis (FEA) and collaborating with cross-functional teams to integrate machine components.
Responsibilities:- Design and develop TCB modules for various applications.
- Manage prototyping, testing, and troubleshooting for thermal performance.
- Optimize system efficiency using CFD/FEA techniques.
- Work closely with engineers to ensure integration of machine components.
- Bachelor's degree in Materials Science, Mechanical, or Electrical Engineering.
- 2-5 years of experience in Semiconductor Equipment Design or packaging.
- Proficiency in computer-aided design (CAD) software, preferably CREO Parametric.
- Familiarity with bonding tools, such as X-ray, scanning acoustic microscopy (SAM), optical microscopy (OM).
This position offers a unique opportunity to work on cutting-edge technology and contribute to the development of innovative TCB solutions.
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