Advanced Thermal Control Engineer

2 weeks ago


Singapore beBeeBonding Full time

Thermal Bonding Specialist

This role plays a critical part in ensuring precise and uniform thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Design & Development: Responsible for 3D design and 2D drawings, bill of materials management, failure mode effects analysis, error budgeting, design for manufacturability and assembly (DFMA). Planning, Scheduling and costing of machines modules. Prototyping & Testing: Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation. Process & Manufacturing Support: Collaborate with Electrical, Vision and Software Engineers for machine integration. Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls) Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems. Support

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