Senior Thermal Bonding Engineer
5 days ago
A thermal bonding specialist is responsible for the design, development and optimization of advanced thermal bonding modules in semiconductor packaging.
The role is critical in ensuring precise, uniform and rapid thermal control during chip-to-wafer or chip-to-substrate bonding. This has a direct impact on process reliability, yield and throughput.
- Design & Development: Design innovative thermal bonding module assemblies for chip-to-wafer or chip-to-substrate bonding.
- Develop 3D designs and 2D drawings, manage Bill Of Materials (BOM), perform Failure Mode Effects Analysis (FMEA) and error budgeting, and ensure Design for Manufacturability and Assembly (DFMA).
- Planning, Scheduling & Costing: Plan, schedule and cost machines modules for thermal bonding equipment.
- Prototyping & Testing: Oversee the fabrication of prototype modules and their integration with thermal bonding platforms.
- Analyze test results, identify design improvements and troubleshoot failures related to temperature non-uniformity, inefficiency or material degradation.
- Process & Manufacturing Support: Collaborate with electrical, vision and software engineers for machine integration.
- Work with the process team to optimize thermal bonding machine performance and efficiency.
- Collaborate with manufacturing engineers to ensure safe, robust assembly of module systems.
-
Thermal Bonding Engineer
2 weeks ago
Singapore beBeeThermal Full timeJob Title: Thermal Bonding Specialist "> A Thermal Bonding Specialist is responsible for designing, developing and optimizing thermal bonding modules used in advanced semiconductor packaging. This role is critical for ensuring precise, uniform and rapid thermal control during chip-to-wafer or chip-to-substrate bonding, directly impacting process...
-
Thermal Bonding Engineer Position
2 weeks ago
Singapore beBeeThermalBonding Full time $80,000 - $120,000Job Title: Thermal Bonding Specialist">The role of a Thermal Bonding Specialist is crucial in ensuring precise, uniform and rapid thermal control during chip-to-wafer or chip-to-substrate bonding.Design & Development: Design innovative thermal bonding modules assemblies for chip-to-wafer or chip-to-substrate bonding. Key responsibilities include creating 3D...
-
Advanced Thermal Bonding Expert
7 days ago
Singapore beBeeThermalBonding Full time $120,000 - $180,000Job Title: Thermal Bonding SpecialistA thermal bonding specialist is a highly skilled professional responsible for designing and developing advanced thermal bonding modules used in semiconductor packaging.Design and Development: Design innovative thermal bonding modules assemblies that meet precise, uniform, and rapid thermal control requirements during...
-
Thermal Bonding Systems Specialist
2 weeks ago
Singapore beBeeBonding Full time $6,000 - $8,000Job Title: Advanced Thermal Bonding EngineerA highly skilled and innovative engineer is required to lead the design, development, and optimization of advanced thermal bonding modules.Key Responsibilities:Design & Development:Design innovative thermal bonding assemblies for chip-to-wafer or chip-to-substrate applications.Develop 3D designs and 2D drawings,...
-
Thermal Bonding Module Design Engineer
2 weeks ago
Singapore beBeeThermalBonding Full time $90,000 - $120,000Job Title: Thermal Bonding SpecialistA THERMAL BONDING SPECIALIST is a critical member of the team, responsible for designing and developing thermal bonding modules used in advanced semiconductor packaging.This role requires expertise in thermal control during chip-to-wafer or chip-to-substrate bonding, directly impacting process reliability, yield, and...
-
Semiconductor Thermal Bonding Specialist
7 days ago
Singapore beBeeDesign Full time $80,000 - $120,000Thermal Bonding Modules DesignerAs a Thermal Bonding Modules Designer, you will be responsible for creating thermal bonding modules to ensure design accuracy and compliance.Key Responsibilities:Create 3D models, 2D drawings, Bill of Materials (BOMs), Failure Mode and Effects Analysis (FMEA), Design for Manufacturing and Assembly (DFMA) to guarantee design...
-
Singapore GlobalFoundries Full timeSMTS - 3D Heterogeneous Integration (thermal solutions for advanced bonding)Join to apply for the SMTS - 3D Heterogeneous Integration (thermal solutions for advanced bonding)role at GlobalFoundries SMTS - 3D Heterogeneous Integration (thermal solutions for advanced bonding)5 days ago Be among the first 25 applicants Join to apply for the SMTS - 3D...
-
Semiconductor Packaging Design Engineer
2 weeks ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer / Semiconductor Packaging Design Engineer Location: Admiralty StreetWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience) Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used...
-
Semiconductor Thermal Control Engineer
1 week ago
Singapore beBeeThermal Full timeJob Description A thermal control engineer plays a pivotal role in ensuring precise and uniform temperature management during semiconductor packaging processes. This involves designing, developing, and optimizing thermal management modules used in bonding equipment for advanced packaging applications. Key Responsibilities: Design and develop thermal...
-
Thermal Control Engineer
2 weeks ago
Singapore beBeeEngineering Full time $90,000 - $120,000Are you a skilled engineer looking to drive innovation in thermal control technology?This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding. A successful candidate will be responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding...
