Thermal Solutions Engineer

2 days ago


Singapore beBeeThermal Full time $120,000 - $200,000
Job Title:
Thermal Solutions Engineer - 3D Heterogeneous Integration

About the Job:
We are seeking a skilled Thermal Solutions Engineer to drive thermal solutions for next-generation hybrid bonding development. As a key member of our team, you will lead 3D heterogeneous integration (3DHI) process development efforts, establish thermal solutions, and plan by working with unit process engineers, manufacturing engineers, and directly with tools & materials.

Responsibilities:
Lead 3DHI process development efforts for establishing thermal solutions required for advanced packaging solutions needed in the product lines. Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs. Develop expertise in processes, materials, and tooling leveraging available characterization resources. Collaborate with vendors and OSATs to develop new wafer level and die level 2.5D and 3DHI processes. Facilitate advanced packaging interactions between the GF Singapore Product Line/Fab teams and customers. Generate IP related to novel wafer integration & packaging technology.

Requirements:
Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program. MS degree with at least 10 years of prior related work experience. Language Fluency - English (Written & Verbal). Travel - Up to 20%.

Preferred Qualifications:
PhD education level preferred with at least 8 years of prior related work experience. Demonstrated prior leadership experience in the workplace, school projects, competitions, etc. Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. Strong written and verbal communication skills. Strong planning & organizational skills.

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