Thermal Bonding Engineer Position

1 day ago

Singapore beBeeThermalBonding Full time $80,000 - $120,000

Job Title: Thermal Bonding Specialist

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The role of a Thermal Bonding Specialist is crucial in ensuring precise, uniform and rapid thermal control during chip-to-wafer or chip-to-substrate bonding.

  • Design & Development: Design innovative thermal bonding modules assemblies for chip-to-wafer or chip-to-substrate bonding. Key responsibilities include creating 3D designs and 2D drawings, managing Bills of Materials (BOM), conducting Failure Mode and Effects Analysis (FMEA) and error budgeting, and implementing Design for Manufacturability and Assembly (DFMA).

Key Responsibilities: The successful candidate will be responsible for designing, developing and optimizing thermal bonding modules used in advanced semiconductor packaging. This includes planning, scheduling and costing machines modules for thermal bonding equipment, overseeing fabrication of prototype modules and their integration with thermal bonding platforms, analyzing test results to identify design improvements and troubleshoot failures related to temperature non-uniformity, inefficiency or material degradation, collaborating with electrical, vision and software engineers for machine integration, and working with the process team to optimize thermal bonding machine performance and efficiency.

Requirements: To succeed in this role, you will need excellent design skills, including 3D design and 2D drawing capabilities. Strong analytical and problem-solving skills are essential, as is the ability to work collaboratively with cross-functional teams. Additionally, experience with thermal bonding processes, materials and equipment is highly desirable.

Benefits: As a Thermal Bonding Specialist, you will have the opportunity to work on cutting-edge technology, collaborate with talented engineers and contribute to the development of innovative products. You will also have access to ongoing training and professional development opportunities.

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