Advanced Semiconductor Bonding Systems Designer

2 days ago

Singapore beBeeDesignEngineer Full time $6,000 - $8,000

Design Engineer - Advanced Semiconductor Bonding Systems

We are seeking a highly skilled Design Engineer to join our team. As a key member of our design team, you will be responsible for designing and developing advanced semiconductor bonding systems.

The ideal candidate will have a strong background in mechanical engineering and experience with CAD design tools such as CREO Parametric. They will also possess excellent problem-solving skills and be able to work effectively in a fast-paced environment.

Job Description

  • Design and develop advanced semiconductor bonding systems
  • Collaborate with cross-functional teams to integrate bonding systems with other equipment
  • Conduct thorough analysis and testing of bonding systems to ensure high-quality results
  • Develop and implement process improvements to increase efficiency and reduce costs

Required Skills and Qualifications

  • Bachelor's or Master's degree in Mechanical Engineering or related field
  • Minimum 2-5 years of experience in design and development of semiconductor bonding systems
  • Strong knowledge of CAD design tools such as CREO Parametric
  • Excellent problem-solving skills and ability to work effectively in a fast-paced environment

Bonding Technology Expertise

  • Experience with TCB (Thermo Compression Bonding) technology is highly desirable
  • Familiarity with thermal and mechanical analysis tools such as CFD and FEA

Desirable Skills

  • Experience with 3D/2D CAD design software
  • Knowledge of bonding equipment and analytical tools

How to Apply

If you are a motivated and experienced Design Engineer looking for a challenging opportunity, please submit your resume for consideration.

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