
Semiconductor Bonding Specialist
2 days ago
Job Title: Semiconductor Bonding Specialist
DescriptionThe successful candidate will play a critical role in designing and developing cutting-edge bonding technologies for the semiconductor industry. As a key member of our team, you will be responsible for creating innovative solutions that drive process reliability, yield, and throughput.
Key Responsibilities:
- Design & Development: Develop novel bonding module assemblies for Chip-to-Wafer or Chip-to-Substrate applications, leveraging 3D design and 2D drawings expertise.
- Prototyping & Testing: Oversee the fabrication of prototype modules and their integration with bonding platforms, analyzing test results and identifying design improvements.
- Process & Manufacturing Support: Collaborate with electrical, vision, and software engineers to integrate bonding equipment, as well as with process teams to enhance machine capabilities.
- Compliance & Documentation: Document designs, simulations, and test results according to quality management and intellectual property standards.
- Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
- Proficiency in 3D/2D CAD tools, preferably CREO Parametric, and exposure to PLM systems like Windchill is a plus.
- Familiarity with TCB or Laser Assisted bonding technologies is highly beneficial.
- Experience with analytical tools (X-ray, SAM, OM, etc.) is required.
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