
Bonding Expert for Semiconductor Innovation
1 day ago
Advanced Bonding Solutions Engineer
You will play a crucial role in designing and developing cutting-edge bonding solutions for semiconductor packaging. This position requires a strong understanding of thermal and mechanical analysis to optimize heating/cooling profiles and minimize thermal gradients across the bondhead/bondstage.
Key Responsibilities:
- Design & Development
- Design innovative bonding module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
- Responsible for 3D design and 2D drawings, Bill of Materials (BOM) management, Failure Mode and Effects Analysis (FMEA), error budgeting, Design for Manufacturability and Assembly (DFMA).
- Planning, Scheduling, and Cost Estimation of Machines Modules.
- Prototyping & Testing
- Oversee fabrication of prototype modules and their integration with bonding platforms.
- Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
- Process & Manufacturing Support
- Collaborate with Electrical, Vision, and Software Engineers for machine integration.
- Collaborate with process teams to improve bonding equipment (e.g., bonder heads, stages, temperature/power controls).
- Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
- Support other teams as needed.
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