Semiconductor Design Engineer

7 hours ago

Singapore beBeeDesign Full time $6,000 - $8,000

Key Position Summary

A Strategic Design Role in Semiconductor Packaging

We are seeking an experienced and skilled semiconductor design engineer to join our team in a strategic role. As a TCB Design Engineer, you will be responsible for designing, developing, and optimizing TCB modules subsystems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.

This critical role ensures precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput. You will work closely with cross-functional teams to design innovative TCB modules assemblies, oversee prototyping and testing, and collaborate on manufacturing and quality management processes.

Responsibilities
  • Design and Development: Create cutting-edge 3D designs and 2D drawings, manage BOMs, perform FMEA, error budgeting, and DFMA activities. Plan, schedule, and cost machines and modules.
  • Prototyping and Testing: Oversee the fabrication of prototype modules and their integration with TCB platforms. Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
  • Process and Manufacturing Support: Collaborate with electrical, vision, and software engineers on machine integration. Work with the process team to improve bonding machines, stages, temperature/power controls, and collaborate with manufacturing engineers on safe and robust assembly of module systems.
  • Compliance and Documentation: Document all designs, simulations, and test results according to quality management and IP standards. Stay updated on relevant industry standards for environment, health, and safety, contamination control, and semiconductor packaging equipment.
Requirements
  • Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
  • 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
  • Experience with TCB or Laser Assisted bonding technologies is highly preferred.
  • Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)

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