High-Precision Bonding Expert
4 days ago
We are seeking a highly skilled Advanced Packaging Process Engineer to develop, optimize and maintain laser bonding processes for high-precision and high-reliability applications.
- Key Responsibilities:
- Develop and implement laser-assisted bonding processes for product packaging, advanced interconnects and micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality and throughput.
- Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.
- Specify, program and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
- Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality and reliability issues in collaboration with operators and maintenance teams.
- Lead initiatives to improve yield, cycle time and cost using data-driven methodologies such as SPC, DOE and Six Sigma tools like PFMEA.
- Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs) and results for compliance and technology transfer purposes.
Required Skills and Qualifications:
- Strong background in advanced packaging, semiconductor manufacturing or a related field.
- Excellent understanding of laser bonding technologies and their applications.
- Ability to develop and implement process improvements, including the use of statistical methods and lean principles.
- Experience with equipment programming and operation, including laser bonder machines.
- Strong analytical and problem-solving skills, with the ability to work collaboratively in a team environment.
Benefits:
- Competitive salary and benefits package.
- Opportunity to work on cutting-edge projects and technologies.
- Collaborative and dynamic work environment.
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