Optimize Laser Bonding Processes for Precision Applications

2 days ago

Singapore beBeeLaserBonding Full time $90,000 - $120,000

Job Title: Advanced Packaging Process Specialist

We are seeking a skilled professional to develop and optimize laser bonding processes for high-precision applications.

About the Role:

  • Create, implement, and refine laser-assisted bonding processes for product packaging and advanced interconnects.
  • Qualify new laser bonding processes from R&D to high-volume production, ensuring seamless transitions.
  • Specify, program, and fine-tune laser bonder equipment and processes for maximum efficiency.
  • Troubleshoot complex laser systems and bonding processes, leveraging data-driven methodologies to drive improvements.
  • Collaborate closely with R&D, operations, maintenance, and quality teams to ensure alignment and excellence.

Requirements:

  • Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • A minimum of 2-5 years of hands-on experience in design and development of equipment or semiconductor packaging processes.
  • Prior experience with Laser Assisted bonding technologies is highly beneficial.
  • Familiarity with bonding equipment and analytical tools is essential.
  • Strong trouble-shooting, risk analysis, FMEA, and statistical analysis skills are required.
  • In-depth knowledge of bonding process and materials behavior under thermal/mechanical stress is necessary.

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