Laser Bonding Expertise

8 hours ago


Singapore beBeeBonding Full time

Job Title: Laser-Assisted Bonder (LAB) Process Engineer

Laser-assisted bonding is a critical process in semiconductor packaging and advanced interconnects. As a LAB Process Engineer, you will be responsible for developing, optimizing, and maintaining laser bonding processes to achieve high precision and reliability.

Key Responsibilities:

  • Process Development & Optimization : Develop and implement laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly. Create recipes and optimize parameters to achieve maximum yield, quality, and throughput.
  • Scale-Up & Qualification : Qualify new laser bonding processes from R&D to high-volume production, working closely with development and production teams.
  • Equipment & Program Management : Specify, program, and refine laser bonder equipment and processes to ensure the right hardware and software configurations for various substrates and products.
  • Troubleshooting & Support : Troubleshoot laser systems and bonding processes, analyzing and resolving yield, quality, and reliability issues in collaboration with operators and maintenance teams.
  • Continuous Improvement : Lead initiatives to improve yield, cycle time, and cost using data-driven methodologies such as Statistical Process Control (SPC), Design of Experiments (DOE), and Six Sigma tools like Process Failure Mode Effects Analysis (PFMEA).
  • Documentation : Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology


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