Advanced Laser Bonding Specialist

3 days ago

Singapore beBeeLaserBonding Full time $90,000 - $120,000
Job Opportunity

The Laser Bonding Specialist is responsible for developing, optimizing, and maintaining advanced laser bonding processes—especially in high-precision, high-reliability applications for Chip-to-Wafer or Chip-to-Substrate bonding.

Main Responsibilities:
  • Laser-Assisted Bonding Development & Optimization: Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput.
  • Process Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.
  • Equipment Management: Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
  • Troubleshooting & Support: Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams.
  • Continuous Process Improvement: Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as Statistical Process Control (SPC) and Six Sigma tools.
  • Documentation: Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology transfer.
  • Cross-Functional Collaboration: Work closely with R&D, operations, maintenance, and quality teams; provide technical training and support for process implementation and equipment operation.
Key Skills & Qualifications:
  • Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
  • Experience with Laser Assisted bonding technologies is highly preferred. Familiarity with laser or optical systems is necessary.
  • Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
  • Familiarity with advanced process control and manufacturing best practices
  • Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
  • Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
  • Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Showcase Your Expertise

Advanced Interconnects
Materiales Science
Preventive Maintenance
FMEA
Stress
Technology Transfer
Throughput
Program Management
Technical Training
Statistical Process Control
PFMEA
Six Sigma
Calibration
Advanced Process Control
Minitab

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