Develop Your Expertise as a Laser Process Engineer

2 days ago

Singapore beBeeLaserEngineer Full time $6,000 - $8,000
Job Title: Laser Process Engineer

Laser process engineers are responsible for developing, optimizing, and maintaining laser bonding processes. The ideal candidate will have expertise in design and development of equipment's or semiconductor packaging or advanced interconnect processes.

Key Responsibilities:
  1. Process Development & Optimization: Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly.
  2. Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high-volume production.
  3. Equipment & Program Management: Specify, program, and refine laser bonder equipment and processes.
  4. Troubleshooting & Support: Troubleshoot laser systems and bonding processes.
  5. Continuous Improvement: Lead initiatives to improve yield, cycle time, and cost using data-driven methodologies.
  6. Documentation: Maintain accurate records of process parameters, recipes, standard operating procedures, and results.
  7. Cross-Functional Collaboration: Work closely with R&D, operations, maintenance, and quality teams.
  8. Safety & Compliance: Ensure adherence to laser safety regulations and best practices.
  9. Customer & Project Support: Provide technical insights and support for customer programs.
  10. Laser Maintenance & Calibration: Perform regular maintenance, alignment, and calibration of laser bonder equipment.
Required Skills & Qualifications:
  • Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
  • Experience with Laser Assisted bonding technologies is highly preferred.
  • Familiarity with bonding equipment and analytical tools.
  • Familiarity with advanced process control and manufacturing best practices.
  • Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis skills.
  • Knowledge of bonding process and materials behaviour under thermal/mechanical stress.
  • Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus.

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