Laser-Assisted Bonder process engineer
1 day ago
Location: Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)
Interested applicants can also send your resume to WA: (Ms Angel) and allow our Consultant to match you with our Clients.
No Charges will be incurred by Candidates for any service rendered.
LIEW ONN KEE REG NO : R
THE SUPREME HR ADVISORY EA NO:14C7279
Overview
A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes-especially in high-precision, high-reliability Advanced Packaging application for Chip-to-Wafer or Chip-to-Substrate bonding.
Key Responsibilities
- Process Development & Optimization: Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput.
- Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.
- Equipment & Program Management: Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
- Troubleshooting & Support: Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams.
- Continuous Improvement: Lead initiatives to improve yield, cycle time, and cost-using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA).
- Documentation: Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology
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