Senior Laser Bonding Process Expert
3 days ago
About the Role:
As a Senior Laser Bonding Process Expert, you will play a key role in developing and optimizing laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly. Your primary responsibilities include creating recipes, optimizing process parameters, and ensuring maximum yield, quality, and throughput.
Key Responsibilities:
1. Develop and implement laser-assisted bonding processes for various substrates and products.
2. Optimize process parameters to achieve maximum yield, quality, and throughput.
3. Collaborate with cross-functional teams to qualify new processes from R&D to high-volume production.
4. Specify, program, and refine laser bonder equipment and processes to ensure optimal hardware and software configurations.
5. Troubleshoot laser systems and bonding processes, analyzing and resolving yield, quality, and reliability issues in collaboration with operators and maintenance teams.
Requirements:
To be successful in this role, you will require a strong background in laser bonding technology, as well as excellent problem-solving skills and experience working with cross-functional teams. You must also be able to maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology purposes.
Benefits:
As a Senior Laser Bonding Process Expert, you will have the opportunity to work on cutting-edge projects, collaborate with talented individuals, and contribute to the development of innovative technologies. You will also receive comprehensive training and support to help you succeed in your role.
Continuous Improvement:
In this role, you will have the opportunity to lead initiatives to improve yield, cycle time, and cost using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA). You will also maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology purposes.
-
Laser Bonding Process Engineer
3 days ago
Singapore beBeeLaserBonding Full timeJob Title:Laser Equipment SpecialistDescriptionWe are seeking a skilled Laser Equipment Specialist to join our team. The successful candidate will be responsible for developing, optimizing, and maintaining laser bonding processes, with a focus on high-precision and high-reliability applications.Key Responsibilities:• Develop and implement laser-assisted...
-
Semiconductor Process Engineer
3 days ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : Laser-Assisted Bonder (LAB) process engineer / Semiconductor Process Engineer (Laser Bonding)Location: Admiralty Street Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding...
-
Advanced Laser Bonding Specialist
3 hours ago
Singapore beBeeLaserBonding Full time $90,000 - $120,000Job OpportunityThe Laser Bonding Specialist is responsible for developing, optimizing, and maintaining advanced laser bonding processes—especially in high-precision, high-reliability applications for Chip-to-Wafer or Chip-to-Substrate bonding.Main Responsibilities:Laser-Assisted Bonding Development & Optimization: Develop, implement, and optimize...
-
Precision Laser Bonding Specialist
3 days ago
Singapore beBeeEngineering Full timeJob Description:">Laser bonding is a precise process of uniting materials using laser light. As a Laser-Assisted Bonder Process Engineer, you will be responsible for developing and optimizing this process to achieve maximum yield, quality, and throughput in Advanced Packaging applications.">Key Responsibilities:">
-
Laser Bonding Process Engineer
1 week ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeRoles & ResponsibilitiesLaser Bonding Process Engineer (Semiconductor/ Advanced Packaging)Location: Admiralty, Singapore Work Schedule: 5 Days, 9AM–6PM Salary: S$ 6,000 – 8,000 (Based on Experience)Key Responsibilities:Develop & optimize Laser-Assisted Bonding processes for Chip-to-Wafer/ Chip-to-Substrate packaging. Scale processes from R&D to...
-
Laser Bonding Expertise
19 hours ago
Singapore beBeeBonding Full time $6,000 - $8,000Job Title: Laser-Assisted Bonder (LAB) Process EngineerLaser-assisted bonding is a critical process in semiconductor packaging and advanced interconnects. As a LAB Process Engineer, you will be responsible for developing, optimizing, and maintaining laser bonding processes to achieve high precision and reliability.Key Responsibilities:Process Development &...
-
High-Precision Bonding Process Engineer
23 hours ago
Singapore beBeeBonding Full time $90,000 - $120,000We are seeking a highly skilled professional to join our team as a High-Precision Bonding Process Specialist.Job DescriptionThis role involves developing and optimizing laser bonding processes for advanced packaging applications. You will work closely with cross-functional teams to develop and implement new bonding processes, optimize existing ones, and...
-
Singapore beBeeBonding Full timeWe are seeking a highly skilled High-Precision Bonding Process Specialist to join our team. As a key member of our engineering group, you will be responsible for developing and optimizing laser bonding processes for advanced packaging applications. This role requires a deep understanding of bonding technologies, materials science, and equipment operation....
-
Laser Process Development Specialist
3 days ago
Singapore beBeeOptimization Full timeJob Title: Laser Process Development Engineer | Electronics Packaging | Optics, Bonding Equipment About the Role:A process engineer is needed to develop and maintain laser bonding processes for product packaging.Main Responsibilities:
-
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeLaser-Assisted Bonder (LAB) process engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging...
