Laser Bonding Process Engineer

2 weeks ago

Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time
Roles & Responsibilities

Laser Bonding Process Engineer
(Semiconductor/ Advanced Packaging)
  • Location: Admiralty, Singapore
  • Work Schedule: 5 Days, 9AM–6PM
  • Salary: S$ 6,000 – 8,000 (Based on Experience)

Key Responsibilities:

  • Develop & optimize Laser-Assisted Bonding processes for Chip-to-Wafer/ Chip-to-Substrate packaging.
  • Scale processes from R&D to High-volume production.
  • Program & troubleshoot Laser Bonder equipment (Hardware/ Software).
  • Improve Yield, Quality & Throughput using DOE, SPC, Six Sigma.
  • Support NPI, Customer Projects & Failure analysis.
  • Ensure Laser Safety & Compliance in production.

Requirements:

  • Degree in Materials/ Mechanical/ Electrical Engineering.
  • 2–5 years in Semiconductor Packaging/ Advanced interconnects.
  • Experience with Laser bonding/ Optical systems (preferred).
  • Knowledge of X-ray, SAM, OM inspection tools.
  • Strong in FMEA, Statistical analysis (JMP/ Minitab).
  • Bonus: HBM, COWOS, 2.5D, fluxless bonding experience.

Daniel Wong

Senior Recruitment Consultant

Reg No: R2095781

THE SUPREME HR ADVISORY PTE LTD

EA No: 14C7279

Tell employers what skills you have

FMEA
Hardware
Throughput
Compliance
Packaging
SPC
Electrical Engineering
Six Sigma
Failure Analysis
Minitab

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