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Advanced Thermal Bonding Expert
2 weeks ago
Job Title: Thermal Bonding Specialist
A thermal bonding specialist is a highly skilled professional responsible for designing and developing advanced thermal bonding modules used in semiconductor packaging.
- Design and Development: Design innovative thermal bonding modules assemblies that meet precise, uniform, and rapid thermal control requirements during chip-to-wafer or chip-to-substrate bonding.
- Design Responsibility: Responsible for 3D design, 2D drawings, BOM management, FMEA, error budgeting, DFMA, and other critical design activities.
- Planning and Scheduling: Plan, schedule, and cost machines and modules for thermal bonding equipment to ensure efficient production.
- Prototyping and Testing: Oversee the fabrication of prototype modules and their integration with thermal bonding platforms.
- Analysis and Troubleshooting: Analyze test results, identify areas for improvement, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
- Process Support: Collaborate with electrical, vision, and software engineers for machine integration and optimize thermal bonding machine performance.
- Manufacturing Support: Ensure safe, robust assembly of module systems by collaborating with manufacturing engineers.
Key Responsibilities:
- Collaborate with process teams to improve the bonding machine's performance and efficiency.
- Support the development of new thermal bonding technologies and techniques.
Requirements:
- Strong background in thermal bonding technology and semiconductor packaging.
- Excellent communication and collaboration skills.
- Ability to work effectively in a team environment.
