Advanced Semiconductor Packaging Engineer

Job Title: High-Temperature Bonding SpecialistRole Summary:We are seeking a skilled professional to design and develop Thermo-Compression Bonding modules for advanced semiconductor packaging. The ideal candidate will be responsible for creating innovative designs that ensure precise, uniform, and rapid thermal control during Chip-to-Wafer or...

Job Title: TCB Design Engineer The role of a TCB Design Engineer is to design, develop and optimize TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies. Key...

TCB Design EngineerThe role of a TCB Design Engineer involves designing, developing and optimizing TCB modules subsystems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This position requires strong technical skills in 3D/2D CAD knowledge, thermal and mechanical analysis, and experience with bonding technologies.Key...

Roles & ResponsibilitiesMicron's vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual...

TCB Design Engineer Job SummaryThis role is responsible for designing, developing, and optimizing TCB modules subsystems used in Thermo-Compression Bonding equipment for advanced semiconductor packaging. The TCB Design Engineer will play a critical part in ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding.

Job Description Responsibilities Equipment Development: • Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking • Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity Equipment Tactics: • Evaluate and promote new equipment...

Job Title: Advanced Thermal Management Engineer for Semiconductor PackagingThe role of an Advanced Thermal Management Engineer is pivotal in designing, developing, and optimizing the thermal control systems used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.Responsibilities:Design and development of innovative thermal...

Job Title:TCB Design EngineerJob Description:We are seeking a skilled engineer to join our team in the design and development of TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. The successful candidate will be responsible for designing, developing, and optimizing TCB modules.Key...

Roles & ResponsibilitiesJob DescriptionResponsibilitiesEquipment Development: • Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking • Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity Equipment Tactics: • ...

Roles & ResponsibilitiesMicron's vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual...