Bonding Solutions Designer

2 weeks ago

Singapore beBeeDesignEngineering Full time $80,000 - $120,000

Design a Bonding Solutions Expert

  • This position involves designing and developing innovative solutions for Chip-to-Wafer/Chip-to-Substrate bonding.

Responsibilities include:

  • Design high-performance TCB modules that meet thermal requirements.
  • Manage prototyping, testing, and troubleshooting of designed TCB modules.
  • Optimize heating and cooling systems through advanced thermal simulations.
  • Cross-functional collaboration with electrical, vision, and software teams to integrate machine components.

Requirements:

  • Bachelor's or Master's degree in Materials Science, Mechanical, Electrical, or related field.
  • 2–5 years of experience in Semiconductor Equipment Design or packaging.
  • Proficiency in CAD software, preferably CREO Parametric, and PLM (Windchill a plus).
  • Knowledge of bonding tools and processes.

This role offers the opportunity to work on cutting-edge technology and collaborate with cross-functional teams. If you have a passion for design engineering and want to contribute to innovative projects, this could be the perfect fit.

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