High-Precision Bonding Process Specialist
1 day ago
We are seeking a highly skilled High-Precision Bonding Process Specialist to join our team. As a key member of our engineering group, you will be responsible for developing and optimizing laser bonding processes for advanced packaging applications.
This role requires a deep understanding of bonding technologies, materials science, and equipment operation. You will work closely with cross-functional teams to develop and implement new bonding processes, optimize existing ones, and troubleshoot issues related to yield, quality, and reliability.
Key Responsibilities:
- Develop and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly
- Qualify new laser bonding processes from R&D to high-volume production
- Specify, program, and refine laser bonder equipment and processes
- Troubleshoot laser systems and bonding processes
- Lead initiatives to improve yield, cycle time, and cost using data-driven methodologies
Requirements:
- Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field
- Minimum 2-5 years of hands-on experience in design and development of equipment or semiconductor packaging processes
- Experience with Laser Assisted bonding technologies is highly preferred
- Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
- Familiarity with advanced process control and manufacturing best practices
- Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis skills
This is an exciting opportunity to work on cutting-edge bonding technologies and contribute to the development of next-generation packaging solutions.
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